The SelectConnect Laser Direct Structuring (LDS) process for manufacturing 3D-MID

An overview of the SelectConnect process of making three dimensional molded interconnects (3D-MID) using the LPKF Laser Direct Structuring (LDS) method of integrating electrical circuits onto injection molded housings and components.
Video Rating: 5 / 5

This module discusses the fundamentals of part cooling; one of the major aspects of the injection molding process. It also features a short instructive excerpt from one of the A. Routsis Associates courses intended to jump start your training initiative.

One Response to “The SelectConnect Laser Direct Structuring (LDS) process for manufacturing 3D-MID”

  • mstuertz:

    Good explaination of the LDS process and metallization of circuits on plastic.