Global Polytec Ltd.,Part.

Posts Tagged ‘3DMID’

An overview of the SelectConnect process of making three dimensional molded interconnects (3D-MID) using the LPKF Laser Direct Structuring (LDS) method of integrating electrical circuits onto injection molded housings and components.
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This module discusses the fundamentals of part cooling; one of the major aspects of the injection molding process. It also features a short instructive excerpt from one of the A. Routsis Associates courses intended to jump start your training initiative.