Low Pressure Molding by Moldman Machines

Simple over-molding process for sealing and protecting electroincs against harsh environment. Replace potting
Video Rating: 5 / 5

2 Responses to “Low Pressure Molding by Moldman Machines”

  • LowPressureMolding:

    @rohima1234
    Sorry for this very very late reply. Our process is primarily used to encapsulate electronic components and to create effective strain reliefs/grommets on cables. The molding material that we use is a high performance Polyamide (read: fancy hot melt) i.e. we use an adhesive molding materials (brand name is Macromelt). Low Pressure Molding typically replaces potting of electronics.

  • rohima1234:

    can i use a silicone mold and syringe pressure by hand to make a laptop lid with two part liquid plastic?
    thanks,
    abz